Mumbai-based Tata Group is currently looking for land to establish a semiconductor chip assembly, testing, monitoring, and packing (ATMP) unit as part of its initial steps toward a local manufacturing ecosystem.
The company has formed a team of 200-250 individuals to work on the project. Company executives are exploring suitable locations in three states of southern India: Karnataka, Tamil Nadu, and Telengana. A final decision has not been taken yet by the company.
“Supply chain for semiconductor chip fabrication unit is sometime away but there is a lot of interest in semiconductor packaging,” said a source who knew about this plan.
Meanwhile, Tata Group has created a semiconductor assembly and packaging company TATA Outsourced Semiconductor Assembly and Test, (OSAT) with Raja Manickam as the chief executive officer.
Packaging and assembly are regarded as stepping stones to the broader global semiconductor fabrication industry.
ATMP and OSAT are crucial steps in testing and packaging chips that are sliced from wafers and integrated into various electronic devices.
Last updated: December 26th, 2025
