Paras Semiconductors, the semiconductor chip unit of Paras Defence and Space Technologies, has signed a technology partnership with BroadPak Corporation, which is based in San Jose, California. The two companies plan to build advanced semiconductor packaging capability in India, The Hindu BusinessLine reported.
Paras proposes an outsourced semiconductor assembly and test facility, known as an OSAT, built around heterogeneous integration and 3D packaging. The unit will focus on 2.5D and 3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification, the companies said.
Paras will gain access to BroadPak’s design, manufacturing and integration intellectual property, along with technology transfer and process know-how. BroadPak, founded in 2007, specializes in advanced packaging design, manufacturing and system integration, according to the companies.
The partners will also explore joint development of packaging platforms for artificial intelligence and high-performance computing, and will work together to train engineers in India. The proposed facility will address high-volume manufacturing and strategic electronics needs, including devices for optical and optronic systems, high-performance computing, networking and data centers.
Munjal Sharad Shah, managing director of Paras Defence and Space Technologies, called the move “a strategic expansion into a technology domain that is increasingly critical to India’s AI and data centres and industrial capabilities.” Santosh Kumar, CEO of Paras Semiconductors, said the company intends to build a packaging platform that meets the performance, connectivity and thermal needs of next-generation applications. Farhang Yazdani, BroadPak’s founder and CEO, said India’s growing semiconductor ecosystem offers an important opportunity to develop capabilities in heterogeneous integration and system-level packaging.
For American chip designers, the structure is the part to watch. BroadPak supplies design and process knowledge, and a partner in India supplies the plant. The report did not give an investment amount, a site or a start date.
