Qualcomm Technologies announced the successful tape-out of its 2-nanometer chip design, developed through its engineering centers in Bangalore, Chennai, and Hyderabad.
The company said the milestone highlights the role of its India operations, which represent its largest engineering presence outside the United States. Teams in India contributed to design implementation, validation, artificial intelligence optimization, and system integration.
The achievement was presented at Qualcomm’s Bangalore facility during a visit by Ashwini Vaishnaw, India’s Minister for Railways, Information & Broadcasting, and Electronics & IT. He stated that the development reflects the growing maturity of India’s semiconductor design ecosystem and aligns with the country’s goal of building a globally competitive semiconductor industry.
The minister added that advanced nodes such as 2 nm involve extreme complexity, with chips packing tens of billions of transistors, and require deep design capability across hardware and software. He noted that the achievement is in line with the government’s broader semiconductor roadmap, which focuses on building capabilities step by step.
Srini Maddali, Senior Vice President of Engineering at Qualcomm India, said the 2nm tape-out demonstrates the depth of engineering capabilities in India and the collaboration between India-based teams and global program and architecture groups.
Qualcomm has invested in India for more than two decades. Its research and development centers in the country work across wireless technology, computing, artificial intelligence, and system-level engineering. According to the company, India-based teams now contribute across multiple layers of system design, from architecture to software platforms.
The achievement comes as India increases efforts to strengthen its semiconductor industry through policy support and industry partnerships, with a focus on expanding its role in advanced chip design.
